Responsibilities
- Drive reliability excellence across system designs (semiconductors, power delivery, thermal management, advanced packaging, PCBs, etc.) from concept to production, using a first-principles approach.
- Address key reliability risks early in the development process by embedding reliability requirements into design specifications and BOM selection.
- Develop and execute accelerated life tests for components, sub-assemblies, and systems.
- Apply physics-of-failure models and tools to predict reliability under operational stresses, and quantify the impact of design choices.
- Simulate reliability of complex electronic systems using software such as Ansys Sherlock.
- Lead FMEA (Failure Modes and Effects Analysis) and other risk analysis methodologies to identify reliability risks, prioritize mitigation strategies, and translate root-cause findings from failure analysis into design/process improvements.
- Champion reliability culture through training, tool development, and data-driven recommendations to stakeholders, including executive leadership.
Skills & Qualifications
Required:
- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 5+ years of experience in Design for Reliability (DfR) for complex electronics systems.
- Deep technical expertise in electronics component and system reliability, including failure modes for PCBs (e.g. solder joint fatigue, via cracking, corrosion) and system-level risks (e.g. thermal mismatch, vibration, power noise).
- Experience designing failure mode-driven accelerated life tests for chips, packaging, or systems, based on first principles fundamentals.
- Familiarity with statistical software for reliability (e.g. JMP, ReliaSoft suite) and with reliability simulation tools (e.g. Ansys Sherlock, COMSOL).
- Demonstrated ability to lead cross-functional teams and facilitate FMEAs.
Preferred:
- Master’s or PhD in a relevant field.
- Coding experience for reliability modeling and data analysis (e.g. Python).
- Knowledge of advanced IC packaging technologies.
The base salary range for this position is $175,000 to $250,000 annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.
